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Static Dissipative Plate

Polstar Static Dissipative Plate (PSDP) is made of clear plastic sheet coated on both sides providing semi-permanent surface resistance of <10e9 ohm, which will help to eliminate static electricity effectively. PSDP is ideal for the speedy decay of static charge without the creation of harmful arcing to the surface of vulnerable components. PSDP satisfies electrical and optical requirements providing superior abrasion, non-scratchable surface and chemical resistance.

PSDP is available with Polycarbonate (high temperature performance, fire resistance and outstanding impact resistance), PMMA (strong surface hardness and optimum clarity), PVC (good chemical resistance) and Aluminum Composition Panel to meet wide applications in each industry.

The new designed PSDP series are also applicable for the special applications of bending and bonding (Polycarbonate is not suitable for the bonding applications) without any crack on the surface and changing the surface resistance after bending.

PSDP is made in Korea. Its manufacturing site and R&D Center are located in Korea as well, those are certified to ISO 9001, Quality Management System and ISO 14001, Environmental Management System. We also have facilities for product development, technical service and quality monitoring and after-sales service.

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Description

Specifications & Products Information
Properties Testing Items Unit PC PMMA PVC AL Test Method
(Polycarbonate) (Acrylic) (Polyvinyl Chloride) (Aluminum)
Physical
Properties
Specific Gravity g/cm2 1.2 1.19 1.4 1.38 ASTM D-792
Water Absorption % 0.1 0.3 0.01 ASTM D-570
Pencil Hardness HB 3H~5H 3H 3H~5H JIS K-5400
Piece Close Adhesion Strength 100/100 100/100 100/100 100/100 JIS K-5400
Mechanical
Properties
Tensile Strength Mpa (kgf/cm2) 58.8~68.6
600~700
560~670 650 8.5 ASTM D-638
Elongation % 90~140 2.0~7.0 20 27 ASTM D- 638
Flexural Strength kgf/cm2 920~980 840~1200 920 1344 ASTM D-790
Flexural Modulus of Elasticity kgf/cm2 2500 2.6 × 104
~3.2 × 104
2.6 × 104 3746 ASTM D-256
Compressive Strength kgf/cm2 1142 ASTM D-256
Izod Shock Strength J/M (kgf cm/cm2) 6 2 6 ASTM D-256
Thermal Properties Burning Resistance Incombustibility
V0~V2
Incombustibility
HB
Incombustibility
V-0
Incombustibility
V-0
UL-94
Coefficient of Linear Thermal Expansion X10-5in/in˚F 3.8 ASTM D-696
Heat Deflection Temp. ˚F/˚C at 264psi 270/132 ASTM D-648
Vicat Softening Temp. ˚F/˚C 310/154 ASTM D-3418
Max Operation Temp. ˚F/˚C 170/77
Thermal Conductivity BTU-in/ft2-hr-˚F 1.3 ASTM D-177
X10-4cal/in/cm-sec-˚C 4.5
Electronical  Properties Surface Resistance ohm <10e9 <10e9 <10e9 <10e9 ASTM D-257
Static  Decay Time Sec Below 0.1 Below 0.1 Below 0.1 Below 0.1 MIL B-81705 B
Size mm 1,000 × 2,000  /  1,200 × 2,400
Thickness mm 2.0 / 3.0 / 4.0 / 5.0 / 6.0 / 8.0 / 10.0
Color Clear transparent, Yellow, Orange, Blue, Brown, Smoke, Opaque in black or Ivory
Remark Other sizes, thicknesses and colors are also available upon request.

Maintenance, Handling, Caution

  • Recommendable storage conditions : less than 30℃, RH40-60%
  • To avoid scratches on the surface, remove the protective film after PSDP has been machined.
  • It is recommendable to have trials with test specimen to determine optimum settings before cutting or modification.
  • Static dissipative coating must be removed from the surface to be glued.
  • Isopropyl Alcohol (IPA) or alcohol based cleaning liquid is recommendable for cleaning.
  • PSDP is not required to be cleaned with antistatic plastic cleaners.
  • Loss of static dissipative performance will occur if excess scratching is concentrated in a particular area.
  • If PSDP is treated with a polishing machine, the performance of static dissipative coating cannot be guaranteed.

 

Applications

  • Cleanroom manufacturing area
  • Semiconductor and Electronics / TFT / LCD manufacturing area and equipment
  • Pharmaceutical and Biomedical processing areas
  • Food processing area
  • Explosive manufacturing areas
  • Aerospace / Automobile related area
  • Equipment viewing windows and doors
  • Equipment enclosures and covers
  • IC chip conveyor systems
  • Dot placement machine
  • Stencil printing machine
  • Wafer handling equipment
  • Desiccator cabinets
  • Transport boxes
  • Perimeter glazing
  • Transparent room partitions
  • Glazing panels for mini-environment and pass-thru units
  • Laminar flow applications
  • Portable cleanroom panels
  • Ceiling panels
  • Mini-environment panels
  • Microbiology filing table covers
  • Sterile filling station panels
  • Barrier system panels
  • Insulator unit covers
  • Machinery guards
  • Separator panels
  • Templates

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