Solder Paste
Description
Lead Free Paste
| Item Code | M02O-004 | M02O-006 | M02O-007 |
| Model | OM353 | OM385SM | OM234HF |
| Soler Alloy | SAC305 (95.5 Sn/3 Ag/0.5 Cu) | ||
| Powder Size | Type 4 (20~38 ㎛) | Type 5 (15~25 ㎛) | Type 6 (5~15 ㎛) |
| Melting Point (°C) | 217~220℃ | 217~220℃ | 217~220℃ |
| Packing type | Jar | Jar | Syringe (10 cc & 5 cc) |
| Features | ·Long stencil life ·High tack force life ·Wide reflow profile ·Excellent void performance |
·Long stencil life ·Long & High tack force life ·Reduced random solder ball ·Good void performance |
|
* Halogen zero
Lead Free & Low Temp Paste
| Item Code | M02O-001 | M02O-005 |
| Model | OM-520 | OM-525 |
| Soler Alloy | 47Sn/57.6Bi/0.4Ag | SAC305 (95.5Sn/3Ag/0.5Cu) |
| Powder Size | Type 3 (25~45 ㎛) | Type 5 (15~25 ㎛) |
| Melting Point (°C) | 138℃ (near eutectic) | 140℃ |
| Packing type | Jar | Jar |
| Features | ·Reduce energy consumption ·Meet IPC 7095 (Voiding performance) CLASS Ⅲ ·Reduce reflow process cycle time ·Use of less expensive PCB |
·Reduce energy consumption ·Reduce reflow process time ·Potential elimination bar solder ·Deliver 8 + hour stencil life |
