The high quality of cross-linked conductive foams are created when carbon-compounded plastic resin is melted and expanded by the dispersion of gas in the liquid resin. The 4 types of Foams, PE, PU, EVA and AR, are available and they can be used in ESD pack aging Industries to protect sensitive IC chips and finished devices fr om ESD damage and outer impact during transportation and storage. (The pre-adhesive treatment on the back side is optional.)
