The high quality of cross-linked conductive foams are created when carbon-compounded plastic resin is melted and expanded by the dispersion of gas in the liquid resin. 4 types of Foams, PE, PU EVA and AR are available and they can be used in ESD packaging Industries to protect sensitive IC chips and finished devices from ESD damage and outer impact during the transportation and the storage.
|Size (m)||1 x 1.8||1 x 2||1 x 1.5||1.2 x 2|
|Thickness(mm)||2 ~ 40||4,5,8,10||2 ~ 25||5 ~ 60|
|Surface Resistivity (ohm/sq)||10e4 ~ 10e6|