Description

 

Product Lead Free Paste
Item Code M02O-003 M02O-004 M02O-006 M02O-008 M02O-007
Model OL107F(A) OM353 OM385SM OM340-SL OM234HF
Soler Alloy SACX0307 (99 Sn/0.3 Ag/0.7 Cu) SAC305 (96.5 Sn/3 Ag/0.5 Cu)
Powder Size Type 4 (20~38 ㎛) Type 4 (20~38 ㎛) Type 5 (15~25 ㎛) Type 4 (20~38 ㎛) Type 7 (2~11 ㎛)
Melting Point (°C) 227℃ 217~220℃ 217~220℃ 217~220℃ 217~220℃
Packing type Jar Jar Jar Jar Syringe (10 cc & 5 cc)
Features
  • Long stencil life
  • Excellent voiding performance
  • High tack force life
  • Wide reflow profile
  • Long stencil life
  • Excellent voiding performance
  • Long & High tack force life
  • Reduced random solder ball
* Halogen zero

 

Product Lead Free & Low Temp Paste
Item Code M02O-001 M02O-005
Model OM-520 OM-525
Soler Alloy 47 Sn/57.6 Bi/0.4 Ag SBX02
Powder Size Type 3 (25~45 ㎛) Type 4 (20~38 ㎛)
Melting Point (°C) 138℃ 140℃
Packing type Jar Jar
Features
  • Reduce energy consumption
  • Reduce reflow process cycle time
  • Meet IPC 7095 (voiding performance) CLASS III
  • Use of less expensive PCB
  • Reduce energy consumption
  • Reduce reflow process cycle time
  • Potential elimination of bar solder
  • Deliver 8 + hour stencil life
* Halogen zero