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Conductive Foam

The high quality of cross-linked conductive foams are created when carbon-compounded plastic resin is melted and expanded by the dispersion of gas in the liquid resin. The 4 types of Foams, PE, PU, EVA and AR, are available and they can be used in ESD packaging Industries to protect sensitive IC chips and finished devices from ESD damage and outer impact during transportation and storage. (The pre-adhesive treatment on the back side is optional.)

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Description

Item Code M01H-000 M02H-000 M03H-000 M18H-000
Material PE PU EVA AR
Density (g/㎤) 0.045 0.041 0.16 0.045
Surface Resistance (ohm) 10e4 ~ 10e6
Thickness (mm) 2 ~ 40 4, 5, 8, 10 2 ~ 25 5 ~ 60
Size (m) 1 × 1.8 1 × 2 1 × 1.5 1.2 × 2
Weight / (㎥) 45 kg 41 kg 160 kg 45 kg

 

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